01485nam a2200397 c 4500001001300000005001500013007000300028008004100031020003400072041001300106049002800119052001700147056001300164082001800177240008500195245013500280246006000415260003600475300004200511500003100553504003400584546004400618650003500662650004000697650004700737700005100784700002200835880004400857880004100901880003000942880003000972900002401002900003201026900001801058950001101076KMO20216005420221021093715ta211129s2021    ulkad         001   kor    a9791156008828g93560:c\320001 akorhjpn0 lEM8126544lEM8126545c201a569.4b21-25  a569.42601a621.3815222300aはじめての半導体ドライエッチング技術.l한국어0KAT202209456006880-01a반도체 드라이 에칭 기술 =xDry etching technology for semiconductors /d노지리 카즈오 著 ;e전민성 譯19aはじめての半導体ドライエッチング技術   6880-02a서울 :b홍릉,c2021  axi, 228 p. :b삽화, 도표 ;c21 cm  a원저자명: 野尻一男  a참고문헌과 색인 수록  a일본어 원작을 한국어로 번역 8a에칭[etching]0KSH1998034673 8a반도체[半導體]0KSH1998000581 8a제조 기술[製造技術]0KSH19980349491 6880-03a노지리 가즈오0KAC2021S71854aut1 6880-04a전민성006245-01/(BaBandoche deurai eching gisul  6260-02/(BaSeoul :bHongneung,c20211 6700-03/(BaNojiri, Gajeuo1 6700-04/(BaJeon, Minseong10a노지리 카즈오10a야고일남,g野尻一男10aNojiri, Kazuo0 b\32000