01392nam a2200373 c 4500001001300000005001500013007000300028008004100031020003400072041001300106049002800119052001600147056001300163082001800176240008100194245009100275246005500366260004200421300004300463500003500506500006100541504003400602546004100636650004000677650004700717650004200764700002700806700004400833880003300877880003900910880002700949900003100976950001101007KMO20212996520230607163448ta210623s2021    ulkad         001   kor    a9791156109471g93560:c\380001 akorheng0 lEM7995259lEM7995260c201a569.4b21-9  a569.42601a621.3815222300aAdvances in chemical mechanical planarization(CMP).l한국어0KAT202312668006880-01aCMP 웨이퍼 연마 /d저자: 수리야데바라 바부 ;e역자: 장인배19aAdvances in chemical mechanical planarization(CMP)  6880-02a서울 :b씨아이알,c2021  axxv, 599 p. :b삽화, 도표 ;c26 cm  a원저자명: Suryadevara Babu  aCMP는 "Chemical Mechanical Planarization"의 약어임   a참고문헌과 색인 수록  a영어 원작을 한국어로 번역 8a반도체[半導體]0KSH1998000581 8a웨이퍼(반도체)[wafer]0KSH1998015164 8a연마(기계)[硏磨]0KSH19980043571 aBabu, Suryadevara4aut1 6880-03a장인배,d1964-0KAC201519419006245-01/(BaCMP weipeo yeonma  6260-02/(BaSeoul :bSsiaial,c20211 6700-03/(BaJang, Inbae10a바부, 수리야데바라0 b\38000