00909nam a2200217 c 4500001001300000005001500013008004100028041001300069049003200082052001700114056001500131082001600146245019700162260003600359300004100395502008000436504003000516650005300546650004700599700004500646KDM20066741620200721103900061124s2006    ulkad      AX 000   kor  0 akorbeng0 lEM3760772lEM3760773c2fDP01a530.432b6-3  a530.432240 a620.18222100a전기 도금 Cu 배선의 확산 방지용 무전해 Ni 도금층의 퇴화 거동=xDegradation of electrolessly deposited Ni diffusion barrier for electroplated Cu interconnects/d崔在雄  a서울:b漢陽大學校,c2006  axiv, 133장:b삽화, 도표;c26 cm1 a학위논문(박사) --b漢陽大學校 大學院,c材料工學部,d2006  a참고문헌: 장 125-133 8a반도체 재료[半導體材料]0KSH2002036425 8a전기 도금[電氣鍍金]0KSH19980185361 a최재웅,g崔在雄0KAC2020970144aut