01386cam a22003371i 4500001001300000005001500013007000300028008004100031040003200072041001300104049003100117052001900148056001300167082001500180100004800195245017800243246007300421264003900494300006000533336002600593337002800619338002700647500002700674502010500701504003300806546003400839856012400873900001800997900001901015900001401034KDM20185759320200727130923ta161221s2017    ulka     m AX 000c  eng    a211062c011012d011001erda0 aengbkor0 lWM884846lWM884847c2fWDP02a620.11b18-252  a530.42601a620.112231 a진상현,g陳尙炫,d1985-0KAC20188029111a(A) study on the through-si-via (TSV) interconnection by electrodeposition =x습식 전해 증착을 통한 관통-실리콘-비아(TSV) 배선공정 연구 /dSanghyun Jin30a(A) study on the through-si-via interconnection by electrodeposition 1aSeoul :bHanyang University,c2017  axiii, 123 leaves :billustrations (some color) ;c26 cm  atextbtxt2rdacontent  aunmediatedbn2rdamedia  avolumebnc2rdacarrier  aAdviser: Bongyoung Yoo1 aThesis(Ph.D.) --bGraduate School of Hanyang University,cDepartment of Materials Engineering,d2017  aBibliography: leaves 115-120  aIn English; summary in Korean40uhttp://www.riss.kr/link?id=T14385037nKERISz이 자료의 원문은 한국교육학술정보원에서 제공합니다.10aJin, Sanghyun10aYoo, Bongyoung10a유봉영