01585pam a2200349 c 4500001001300000005001500013007000300028008004100031020002500072023001800097041001300115049002800128052001800156056001400174082001900188245014300207260007500350300003800425500015100463500007800614500008900692546005100781650006000832650006000892700002700952700005600979880004701035880007701082880003001159880002901189950001701218KMO20174967820171221145535ta170324s2017    ulkad         000   kor    a9791185438108g93550  aCIP20170077500 akoraeng0 lEM6727047lEM6727048c201a569.31b17-12  a569.312601a621.381531223006880-01a2017년 KAMP 국제 심포지움 :b자동차 전장모듈 제조 패키징 최신 기술동향 /dedited by 최명기,e정재필  6880-02a서울 :b한국마이크로전자패키징연구조합,c2017  a172 p. :b삽화, 도표 ;c30 cm  a표제관련정보: Trend of advanced electronics packaging technology for automotive industry ; SMT/PCB & NEPCON Korea 2017 전시회 참관(겸)  aKAMP는 'The Korean Association of Microelectronics Packing'의 약어임  a일시 및 장소: 2017. 4. 6.(목), 10:00 - 16:45, 코엑스 컨퍼런스룸 401호  a본문은 한국어, 영어가 혼합수록됨 8a인쇄 회로 기판[印刷回路基板]0KSH1998000637 8a전자 기기 부품[電子器機部品]0KSH20040273861 6880-03a최명기4aut1 6880-04a정재필,g鄭在弼,d1959-0KAC201500614006245-01/(Ba2017 nyeon KAMP gukje simpojium  6260-02/(BaSeoul :bHanguk Maikeuro Jeonja Paekijing Yeongu Johap,c20171 6700-03/(BaChoe, Myeonggi1 6700-04/(BaJeong, Jaepil1 a가격불명