00970nam a2200229 a 4500001001300000005001500013007000300028008004100031041001300072049001800085052002100103056001300124082001800137100004800155245030200203260002800505300004400533502006900577504003300646546003400679900002700713KDM20130737820200721130355ta130722s2012    tjkad    m CB 000   eng  0 aengbkor0 lWM742255fWDP02a621.38152b13-31  a569.42501a621.381522211 a김명회,g金明會,d1980-0KAC20185898310aSegmentation method for modeling and simulation of electromagnetic bandgap (EBG) structures in three-dimensional integrated circuit (3D-IC) and package =x구조분할방법을 이용한 3차원 반도체 및 패키지 내의 EBG 구조 모델링 및 시뮬레이션 방법 제안 /dKim, myunghoi  aDaejeon :bKAIST,c2012  axi, 110 leaves :bill., charts ;c30 cm1 aThesis(Ph.D.) --bKAIST,cDept. of Electrical Engineering,d2012  aBibliography: leaves 107-110  aIn English; summary in Korean10aGim, Myeonghoe,d1980-