00841nam a2200217 c 4500001001300000005001500013007000300028008004100031041001300072049001800085052001700103056001400120082001500134245023500149260002700384300004200411502006300453504002900516546002500545700005300570KDM20114025020201008112445ta110804s2011    tjkad    m CB 000   kor  0 akorbeng0 lEM5157589fDP01a530.43b11-5  a530.432501a620.1822100a표면활성화 접합에 의한 Cu-Ni 정밀층상 복합소재의 제조공정 및 접합특성 =xFabrication process and bonding properties of Cu-Ni fine clad materials prepared by surface activation bonding (SAB) /d김경훈  a대전 :bKAIST,c2011  axi, 166 p. :b삽화, 도표 ;c26 cm1 a학위논문(박사) --bKAIST,c신소재공학과,d2011  a참고문헌: p. 163-166  a영어 요약 있음1 a김경훈,g金庚勳,d1973-0KAC2018672464aut